TSMC Verifies Fully Functional 90 Nanometer Chips Using Immersion Lithography Tools; Findings Suggests Immersion is Nearly Ready For Production
HSINCHU, Taiwan & SAN JOSE, Calif.—(BUSINESS WIRE)—Dec. 22, 2004—
Taiwan Semiconductor Manufacturing Company
(NYSE:TSM)(TSE:2330), said that it used immersion lithography tools to
produce fully functional 90nm devices. The finding was presented in a
keynote speech at the Cymer Lithography Symposium in Semicon Japan on
December 1, predating a similar announcement.
TSMC's circuits represent the first data that immersion-based
lithography systems are nearing production-ready status.
Dr. Burn J. Lin, senior director of TSMC's micropatterning
division, reported in the December keynote speech that TSMC had
fabricated electrically functioning 90nm SRAM chips using a
90nm-node-capable prototype immersion scanner from ASML. The wafer
batch was split at ASML for both immersion and dry exposures at
critical layer before metal. After developing the resist image, the
wafers were sent back to TSMC to complete the fabrication steps.
Yield, device characteristics and defect levels were comparable
for both dry and wet scanners. The yield-related depth of focus of the
immersion scanner is almost twice that of the dry scanner.
"While some optimization may still be in order, we have promising
results pointing to immersion lithography systems and tools capable of
producing functional deep-submicron devices that will scale well below
the 90nm node," said Dr. Lin. "The larger focal range is the most
significant finding, because it suggests that immersion tools can
safely image with better yield than previously anticipated. This
finding can be extrapolated to infer even greater benefits at the 65nm
node."
TSMC estimates that immersion lithography tools may be called upon
for 65nm production and are the chosen candidates for 45nm production.
TSMC began installing its first 65nm immersion lithography system in
early November this year.
About TSMC
TSMC is the world's largest dedicated semiconductor foundry,
providing the industry's leading process technology and the foundry
industry's largest portfolio of process-proven library, IP, design
tools and reference flows. The company operates two advanced 300mm
wafer fabs, five eight-inch fabs and one six-inch wafer fab. TSMC also
has substantial capacity commitments at its wholly-owned subsidiary,
WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. In
early 2001, TSMC became the first IC manufacturer to announce a 90-nm
technology alignment program with its customers. TSMC's corporate
headquarters are in Hsinchu, Taiwan. For more information about TSMC
please see http://www.tsmc.com.
Contact:
TSMC North America
Dan Holden, 408-382-7921 or 408-910-1141 (cell)
Dholden@tsmc.com
